Product Overview

Ultra-Table is a compact desktop scientific CT X-ray machine with closed X-ray tube and three optional models (T-130/T-130A/T-160). It equips amorphous silicon flat panel detector with up to 3μm resolution, supporting different sample sizes for small PCBA and semiconductor packaging inspection. Integrated full-process AI software realizes one-click scanning, 3D reconstruction and automatic defect analysis with seconds-level imaging. Featuring small footprint, light weight and simple operation after brief training, it detects various SMT solder flaws like cold joints, bridging and foreign objects. Customizable parameters are available for laboratory and small-batch industrial non-destructive testing.
 

Equipment characteristics

1. Small footprint, high scanning accuracy, and easy operation.  
2. One-click full-process automation for data scanning, 3D reconstruction, and image   analysis.
3. Compact structure with low space requirements.

Basic Parameters

Ray source parameter

Detector parameter

Equipment Performance Parameters Details

More Precise, More Efficient, More User-friendly

1.More Precise

The combination of artificial intelligence and industrial CT delivers more accurate imaging inspection results.  
Fully apply target - driven end - to - end AI technology to processes such as system design, system calibration, data acquisition, image reconstruction, and image recognition.

2.More User-friendly

Intuitive operation interface, convenient operation process. With simple training, you can easily use the CT inspection equipment. It's the ideal choice for complex inspections in industrial settings.

3.More Efficient

Integrated operation of scanning, reconstruction, and automatic recognition enables higher - efficiency detection performance.  
Utilizing algorithms like the deep reconstruction algorithm for sparse - angle low - dose fast CT images and the deep neural network denoising algorithm for projection data based on simple calibration phantoms... an integrated method of image reconstruction and detection driven by detection targets is achieved through deep learning. With core algorithms of full independent intellectual property rights and the design ability of software - hardware integration, the detection efficiency is one or several orders of magnitude higher than that of the industry.

Application description and sample images

Applicable for Large size PCBA board, Internal structural quality of semiconductor packaging products, SMT welding quality of various types of solder joints, such as open welding, whether there is infiltration, solder amount, offset, foreign body, bridge, pin and so on.

1). SMT & PHT Package Inspection
Main Inspection Objects:  BGA, LED, LGA, QFN/QFP, TSV, etc.
Main Inspection Scope:
•SMD components: Voids, bridging, open joints, insufficient solder, void percentage, tombstoning, etc.
•Through-hole components: Pin presence/absence, solder penetration height, solder fill rate, etc.
•Crimp components: Bent pins, broken pins, incomplete crimping, etc.

2). Integrated Circuit Inspection
Main Inspection Objects: PCBA (stub value), semiconductors, chip bonding wires, IC leads, IGBTs, sensors, MEMS, etc.
Main Inspection Scope:
• Internal delamination, cracking, voids, and bonding-wire integrity.
•Bridging, open circuits, short circuits.
•Dimensional measurement of internal assembly structures for electronic components, failure analysis, etc.

BGA solder ball bridging	Auto-identify & locate LGA voids, batch-calculate void percentage.	3D observation for BGA solder ball shape
DIMM pin solder wetting height inspection	Chip bonding-wire open & cold solder joints	Whole-board inspection for integrated circuits