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Product Overview

The micro-focus X-ray inspection system employs a micro-focus X-ray tube as the radiation source, leveraging the principle that different materials exhibit varying X-ray absorption and attenuation due to differences in atomic number and density—high-density materials absorb more X-rays and appear as dark regions, while low-density materials absorb less and appear as bright regions, forming grayscale transmission images upon reception by a flat-panel detector. The extremely small focal spot enables geometric magnification of several hundred times, clearly revealing micron-level internal details. The system has X, Y, Z three axes for 2D inspection, and is widely applied in PCBA solder joint defect detection, internal structural observation of semiconductor packaging, identification of cracks and foreign objects in components, and product failure analysis, serving as a core instrument for non-destructive quality control.

Our Advantages

1. Closed type X-ray tube, with more than 10000 hours lifetime, maintenance-free.

2. New generation 5” HD digital flat panel detector (FPD).

3. Automatic navigation window, the table will move to where you click.

4. 420*420mm table with 15KG load capacity.

5. Speed adjustable 3 axis linkage system.

6. Can edit inspection procedures to achieve automated inspection in large quantities.

7. 360° rotary jig optional, can inspect the product from different angles.

8. Easy to operate, can quickly find defects, only need 2 hours to train.

Hardware Specifications

X-ray source	Type	Closed, microfocus
	Max tube voltage	90kV
	Max tube current	200μA
	Focal spot size	5μm
	Function	Auto preheat
Flat panel detector	Effective area	130mm*130mm
	Pixel size	85μm
	Resolution	1536*1536
	Frame rate	20fps
Table	Size	420mm*420mm
	Detectable area	400mm*400mm
	Max load	15kg
Equipment	Magnification	Geometry 150X	System 1500X
	Inspection speed	Max 3.0s/point
	Dimensions	1100mm (L) * 1000mm (W) * 1600mm (H)
	Weight	1000kg
	Power supply	AC110-220V 50/60HZ
	Max power	1300W
	Industrial PC	Intel I5 CPU,8G RAM, 240GB SSD
	Displayer	24” HDMILCD
Safety	Radiation leakage	No leakage,international standard: ≤1μSv/h
	Lead glass observation window	Transparent lead glass window shields radiation to observe the inner status.
	Window and back door safety interlock	Once users open the window or back door, X-ray tube will power off immediately. When the window or back door is open, users can’t turn on the X-ray.
	Electromagneticsafety switch	Lock once the X-ray is on, users can’t open the observation window.
	Emergency stop	Next to the operation position, press to power off
	Tube protection	User can't leave the software to if you don't close the X-ray tube.

Software Functions

Function module	Operation	Keyboard andmouse can finish all operations
	X-ray tube control	Using mouse to click the X button can turn on or off the X-ray. The real-time tube voltage and current value will display beside, users can click up and down button, or drag the slider, or type to adjust.
	Status bar	Indicates the interlock status,pre-heat status, and X-ray status by flashing alternately red and green.
	Image effect adjustment	The brightness, contrast and gain of the image can be adjusted freely to achieve a satisfactory result.
	Product list	Users can save the inspection parameters such as Z-axis position, brightness, contrast and gain, and can directly call the parameters when inspecting the same product, to improve the inspection efficiency.
	Navigation window	After the camera takes a photo of the table, click anywhere in the photo, the table will move to the place you click and display on the screen.
	Motion axis status	Display real-time coordinates.
	Inspection result	The measurement results (voids rate, distance, area, etc., set by users) display in order.
	Speed control	The movement speed of each axis can be adjusted to slow, normal and fast.
Voids rate measurement	Automatic calculation	Click on two points to determine a rectangle. The software automatically finds and measures the edge of the solder ball in the rectangle, the pad and the internal voids, and can get the data of the voids rate, the area of the solder ball, the circumference, the biggest void’s rate, the length and the width, and indicates NG or OK by red and green.
	Parameters adjustment	Users can adjust the grayscale threshold, pixel, contrast, size filtering and other parameters to get accurate results of automatic calculation.
	Add voids manually	Users can draw a polygon or a free figure and calculate it as a void into the void rate.
	Save parameters	Users can save parameters such as grayscale threshold, pixel, contrast, size filtering and other parameters, and can directly call the parameters when detecting the same product, to improve the detection efficiency.
Other measurement function	Distance	Click the A and B points to set as the baseline, then click the C point to measure the vertical distance from the C point to the baseline.
	Distance rate	It is mostly used to measure the soldering rate of the through-hole. Set one more point “D” than the distance. Divide the vertical distance from the D point to baseline by the vertical distance of the C point, to obtain the percentage ratio of the vertical distance of D to C.
	Angle	Click the A and B points to set as the baseline, then click the C point to measure the angle between the BA and BC rays.
	Radius	It is mostly used to measure round components such as solder balls. Click three points to determine a circle and measure the circumference, area and radius.
	Perimeter	It is mostly used to measure square components, click two points to determine a square, measure the length, width and area.
Automatic inspection	Manual setting	Users can set any positions on the table as inspection points, the software will automatically inspect and save the picture.
	Array	For the regular inspection points, users only need to set two of the inspection points and the number of rows and columns, the software will automatically inspect each point and save pictures.
	Automatic identification	For inspection points with obvious features, the software automatically identifies the positions, takes measurements, and saves the image.

Application description and sample images

1. Electronic Assembly and Packaging Inspection
Primarily used for PCBA solder joint quality inspection, including internal solder joint defects of high-density packaged devices such as BGA, CSP, and QFN (e.g., cold solder, bridging, voids, void ratio analysis), as well as internal layer alignment and short-circuit detection in multilayer PCBs.
2. Semiconductor and Chip Analysis
Applicable for internal structural observation of chip packaging, including wire bond quality, underfill of flip chips, interconnect integrity of 3D IC chip stacking, and micro-bump inspection in wafer-level packaging.
3. Component and Material Inspection
Capable of detecting internal structural integrity of components such as capacitors, connectors, and relays, identifying defects like cracks, misalignment, and foreign objects; also used for internal structural analysis of electronic materials.
4. R&D and Failure Analysis
Used for non-destructive verification of design structures during product development, and for assisting in root cause localization during failure analysis. It supports both 2D imaging and 3D CT scanning, meeting diverse needs from routine quality inspection to precision analysis.
With its high resolution and non-destructive characteristics, this equipment serves as a key tool for quality control and reliability assessment in electronics manufacturing.

BGA solder bridge	BGA solder voids	PCB through-hole

IC voids and gold wire	LED solder voids	LED gold wire crack

Capacitor	Inductor	Sensor

Thyristor surge suppressors	Fiberglass	Cable

Diode	Steel pipe welding gap	Automobile electronics

Factory description

Wellman, a professional X-Ray inspection manufacturer which is integrates R&D, production and sales that is set up in China by Hong Kong-invested enterprises.

Wellman has many years of professional R&D team at home and abroad, has been committed to the global intelligent manufacturing equipment industry to provide micro-focus X-ray image detection equipment, casting process detection equipment, lithium battery reliability and safety detection equipment and special non-standard automation equipment one-stop service program.

Our headquarters locates in Shenzhen, since 2003, mainly engaged in automation technology, software technology and big data technology R&D, with more than 30 national patents and software copyright.

Our Advantages

R&D Strength

We independently master core technologies of micro-focus imaging and AI intelligent inspection. Our equipment meets international standards and adapts to high-precision X-ray inspection and SMD storage in various industries.

Global Compliance

Certified with ISO, CE, FDA and other authoritative international certifications, our products comply with global export standards and meet market access requirements worldwide.

Integrated Solution

We provide a full range of X-ray equipment and customized non-standard solutions, delivering one-stop systems including inspection equipment and SMD intelligent storage management.

Industry Reputation

With rich experience, our equipment is fully verified by mass factories and widely recognized by global customers for stable and reliable performance.

Global Service

Our global service system provides full-cycle one-stop support, including solution customization, installation training, technical maintenance and software upgrades.

Quality & Value

Supported by mature independent R&D and standardized production, we strictly follow international quality standards to deliver cost-effective and highly adaptable professional inspection solutions.

Knowledge

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Certifications

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X6000 X-ray Inspection System

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X-Ray Inspection System

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