Product Overview

Ultra-One is a nano-grade industrial CT X-ray equipment fitted with an open X-ray source ranging 20–160kV and amorphous silicon flat panel detector. It supports detachable interchangeable modules to realize 2D, 2.5D and 3D cone-beam CT imaging with multi-axis linkage. Equipped with multiple test benches, it fits large PCBA and tiny chips, delivering resolution up to 0.5μm. Integrated AI algorithms enable fast scanning, reconstruction and auto defect analysis. With complete dedicated imaging software, it inspects solder voids, open joints and internal structures of semiconductors, featuring high precision, high efficiency and easy operation for advanced electronic non-destructive testing.

Equipment characteristics

1. 2D/2.5D imaging can achieve multi-axis linkage imaging function for ROI;
2. With imaging enhancement function; With automatic analysis function;
3. With image analysis function; With scanning programming function;
4. Optional rotating disk imaging module for more Angle observation;
5. 3D imaging detection is realized for local devices on the whole board.
6. For small devices, optional turntable and cone-beam CT imaging functions are available。

Basic Parameters

X-ray Source Parameters

Detector parameter

Equipment Performance Parameters Details

High-precision Planar CT —— Lamination Pro

The overall system adopts a design in which the X-ray source and the detector are installed in an upper-lower configuration. With a stable structure, it facilitates high-resolution inspection imaging of plate-shaped samples such as PCBA.

As shown in the figure below, the overall structure of the product includes the X-ray source motion mechanism, the imaging motion mechanism, the detector motion mechanism, and a variety of imaging modules. The different imaging modules are designed to be detachable and replaceable, which makes it convenient to use different imaging functions. Based on the above-mentioned multi-axis motion and imaging modules, the product can achieve 2D, 2.5D, and 3D visualization imaging.

Working Modes - DR Imaging

The X-ray source emits X-rays that pass through the object under test. The detector then collects data and generates images.

Working Modes - CL Imaging

The X - ray source emits X - rays, the turntable rotates, and the detector reconstructs the 3D volume data of the measured object through projection images at different angles.

It is applicable to the inspection of large and thin plate - shaped samples. Thanks to the uniquely designed detector deflection and rotation imaging module, 2.5D imaging at different angles can be achieved. Additionally, the system has a multi - axis linkage function, which ensures that the ROI remains unchanged during inspections at different angles, enhancing usability.

Working Modes - CT Imaging

The X - ray source emits X - rays, the turntable rotates, and the detector reconstructs the 3D volume data of the measured object through projection images at different angles.

Suitable for 3D inspection of thick and wide small samples like chips and small - sized PCBs. It can achieve high - quality and high - precision 3D imaging via micro - CT scanning.

More Precise, More Efficient, More User-friendly

1.More Precise

The combination of artificial intelligence and industrial CT delivers more accurate imaging inspection results.  
Fully apply target - driven end - to - end AI technology to processes such as system design, system calibration, data acquisition, image reconstruction, and image recognition.

2.More User-friendly

Intuitive operation interface, convenient operation process. With simple training, you can easily use the CT inspection equipment. It's the ideal choice for complex inspections in industrial settings.

3.More Efficient

Integrated operation of scanning, reconstruction, and automatic recognition enables higher - efficiency detection performance.  
Utilizing algorithms like the deep reconstruction algorithm for sparse - angle low - dose fast CT images and the deep neural network denoising algorithm for projection data based on simple calibration phantoms... an integrated method of image reconstruction and detection driven by detection targets is achieved through deep learning. With core algorithms of full independent intellectual property rights and the design ability of software - hardware integration, the detection efficiency is one or several orders of magnitude higher than that of the industry.

Application description and sample images

Applicable for Large size PCBA board, Internal structural quality of semiconductor packaging products, SMT welding quality of various types of solder joints, such as open welding, whether there is infiltration, solder amount, offset, foreign body, bridge, pin and so on.

1). SMT & PHT Package Inspection Main Inspection Objects:  
BGA, LED, LGA, QFN/QFP, TSV, etc. Main Inspection Scope:
•SMD components: Voids, bridging, open joints, insufficient solder, void percentage, tombstoning, etc.
•Through-hole components: Pin presence/absence, solder penetration height, solder fill rate, etc.
•Crimp components: Bent pins, broken pins, incomplete crimping, etc.

2). Integrated Circuit Inspection Main Inspection Objects:
PCBA (stub value), semiconductors, chip bonding wires, IC leads, IGBTs, sensors, MEMS, etc.
Main Inspection Scope:
• Internal delamination, cracking, voids, and bonding-wire integrity.
•Bridging, open circuits, short circuits.
•Dimensional measurement of internal assembly structures for electronic components, failure analysis, etc.

BGA solder ball bridging	Auto-identify & locate LGA voids, batch-calculate void percentage.	3D observation for BGA solder ball shape
DIMM pin solder wetting height inspection	Chip bonding-wire open & cold solder joints	Whole-board inspection for integrated circuits