Product Overview

Ultra-One is a nano-grade industrial CT X-ray equipment fitted with an open X-ray source ranging 20–160kV and amorphous silicon flat panel detector. It supports detachable interchangeable modules to realize 2D, 2.5D and 3D cone-beam CT imaging with multi-axis linkage. Equipped with multiple test benches, it fits large PCBA and tiny chips, delivering resolution up to 0.5μm. Integrated AI algorithms enable fast scanning, reconstruction and auto defect analysis. With complete dedicated imaging software, it inspects solder voids, open joints and internal structures of semiconductors, featuring high precision, high efficiency and easy operation for advanced electronic non-destructive testing.
 

Equipment characteristics

1. Full 3D automatic imaging and analysis.   
2. Applicable for both on-line inspection and off-line analysis.
3. Capable of achieving fast CT imaging, with the fastest local imaging time less than 3 seconds.
4. Solves the problem of solder joint defect inspection that cannot be achieved by traditional 2D and 2.5D equipment.
5. Can be connected to the user's database to directly import inspection results.

Basic Parameters

X-ray Source Parameters Details 

Detector parameter

Equipment Performance Parameters Details

More Precise, More Efficient, More User-friendly

1.More Precise

The combination of artificial intelligence and industrial CT delivers more accurate imaging inspection results.  
Fully apply target - driven end - to - end AI technology to processes such as system design, system calibration, data acquisition, image reconstruction, and image recognition.

2.More User-friendly

Intuitive operation interface, convenient operation process. With simple training, you can easily use the CT inspection equipment. It's the ideal choice for complex inspections in industrial settings.

3.More Efficient

Integrated operation of scanning, reconstruction, and automatic recognition enables higher - efficiency detection performance.  
Utilizing algorithms like the deep reconstruction algorithm for sparse - angle low - dose fast CT images and the deep neural network denoising algorithm for projection data based on simple calibration phantoms... an integrated method of image reconstruction and detection driven by detection targets is achieved through deep learning. With core algorithms of full independent intellectual property rights and the design ability of software - hardware integration, the detection efficiency is one or several orders of magnitude higher than that of the industry.

Application description and sample images

Applicable for large-sized PCBA boards, the internal-structure quality of semiconductor packaging products, and the soldering quality of various types of SMT solder joints, such as open joints, wetting conditions, solder volume, offset, foreign objects, bridging, and pin integrity.

1). SMT & PHT Package Inspection
Main Inspection Objects:
 BGA, LED, LGA, QFN/QFP, TSV, etc.
Main Inspection Scope:
•SMD components: Voids, bridging, open joints, insufficient solder, void percentage, tombstoning, etc.
•Through-hole components: Pin presence/absence, solder penetration height, solder fill rate, etc.
•Crimp components: Bent pins, broken pins, incomplete crimping, etc.

2). Integrated Circuit Inspection
Main Inspection Objects:
PCBA (stub value), semiconductors, chip bonding wires, IC leads, IGBTs, sensors, MEMS, etc.
Main Inspection Scope:
•Internal delamination, cracking, voids, and bonding-wire integrity.
•Bridging, open circuits, short circuits.
•Dimensional measurement of internal assembly structures for electronic components, failure analysis, etc.

BGA solder ball bridging	Auto-identify & locate LGA voids, batch-calculate void percentage.	3D observation for BGA solder ball shape
DIMM pin solder wetting height inspection	Chip bonding-wire open & cold solder joints	Whole-board inspection for integrated circuits