Product Overview

90KV Hamamatsu Microfocus X-ray Tube（110KV,130KV optional）
The Hamamatsu Microfocus X-ray sources were developed specifically for X-ray non-destructive inspection. These X-ray sources use an X-ray tube with a small focal spot of several micro-meters to 10 micro-meters, capable of producing a clear X-ray image even at a high magnification. The RS-232C interface is provided as a standard feature, allowing automatic operation by external control.
The X-ray tube has an air-cooled and hermetically sealed structure, and is integrated with its high voltage power supply for easy handling. (High voltage cables are not required.)
 

Model list
Hamamatsu L11831-01 
Hamamatsu L9631
Hamamatsu L9181-02        
Hamamatsu L9181-05
Hamamatsu L12161-07
Hamamatsu L11831
Hamamatsu L9181
Hamamatsu L10941
Hamamatsu L10941-01
Hamamatsu L10941-05      
Hamamatsu L12531
Hamamatsu L14351-02
Hamamatsu V10905P
Hamamatsu V10905P-01
Hamamatsu V7227P-03

Product advantages

1. Ultra-small focal spot delivers outstanding imaging resolution for detecting micro defects.
2. Integrated high-voltage structure eliminates external HV cables and interference risks.
3. Stable long-term radiation output, ideal for 24/7 continuous production.
4. Sealed type features long service life up to 10000 operating hours.
5. Built-in multi-protection mechanisms ensure safe and reliable operation.
6. Standard communication interfaces support easy integration with automated production lines.
7. Wide adjustable voltage range adapts to diverse inspection workpieces.
8. Complete global certifications and mature spare parts supply system.

Hardware parameters

Application description and sample images

1. PCBA Assembly and Packaging Defect Inspection
The equipment specializes in professional quality inspection of PCBA solder joints. It is capable of detecting internal defects in high-density packaged devices such as BGA, CSP and QFN, including cold solder, solder bridging, voids and void ratio analysis. It also supports inner layer alignment inspection and short-circuit detection for multi-layer PCB boards.
2. Semiconductor & Chip Packaging Structure Analysis
It is applied to the internal structure inspection of semiconductor packaging and chips. The inspection scope covers wire bond quality, flip-chip underfill status, interconnection integrity of 3D IC stacking, and micro-bump conditions of wafer-level packaging.
3. Electronic Component & Material Internal Detection
This system verifies the internal structural integrity of common electronic components including capacitors, connectors and relays, accurately identifying cracks, misalignment and foreign matter defects. It is also applicable to internal structure analysis of various electronic materials.
4. Product R&D Verification & Failure Analysis
Supporting non-destructive structural verification during product research and development, the equipment assists engineers in locating root causes during product failure analysis. With integrated 2D imaging and 3D CT scanning functions, it adapts to both routine quality inspection and high-precision analytical scenarios.
Equipped with high-resolution imaging and non-destructive testing advantages, the equipment serves as a critical testing instrument for quality control and reliability assessment in electronic manufacturing.