Product introduction
Product Overview
Rayence Flat Panel Detector 0505A/1215A
Rayence has built the world’s first full line-up of dental, medical, veterinary, and industrial X-ray flat panel detector products. Also, Rayence is the only company in Korea that has the techniques for designing CMOS Wafer, developing flat panel detectors (TFT), and using the core technology of scintillator, which is used for radiation detection.

Model list
•0505A
•0712FCA/FGA
•1215A
•1215MGF
•1215FCB.FGB
•MIDAS2121
Product advantages
1. Dynamic range(Above 30fps)
2. No Image Lag
3. Low dose with High resolution (49.5 ㎛)
4. Fast readout without data loss
Hardware parameters
|
Scintillator |
CsI : TI / Gd₂O₂S:Tb |
|
Active Area |
58 x 54 mm |
|
Pixel Pitch |
49.5 ㎛ |
|
Limiting Resolution |
10 lp/mm |
|
A/D Conversion |
14 bits |
|
Frame Rate |
30 (1×1) / 100 (2×2) fps |
|
Interface |
GigE or Camera Link (option) |
|
Energy Range |
~160 kVp |
|
Dimension(W x L x H) |
146 x 214 x 33.7 mm |
|
Weight |
1.9 kg (4.18lbs – Can be changeable by option) |
Application description and sample images
1. Precision Inspection for PCBA and Packaging Solder Joints
This testing equipment realizes high-precision non-destructive detection for PCBA soldering quality. It can effectively identify internal soldering defects of high-density packaged electronic devices, including insufficient soldering, solder bridging and pore defects, and conduct quantitative analysis of void ratio. Furthermore, it realizes precise detection of interlayer alignment deviation and hidden short-circuit defects in multi-layer PCB structures.
2. Microstructural Analysis for Semiconductor Chip Packaging
The system is applicable to microscopic observation and structural evaluation of chip packaging structures. Its inspection scope covers wire bonding reliability, underfill uniformity of flip-chip devices, structural integrity of 3D IC stacked interconnection systems, and micro-bump morphological defects in wafer-level packaging technology.
3. Internal Structure Evaluation of Components & Electronic Materials
It performs integrity evaluation of internal structures for passive and active electronic components represented by capacitors, connectors and relays, capable of detecting structural defects such as internal cracks, assembly misalignment and foreign residue inclusion. Meanwhile, it provides microscopic structural analysis support for electronic material performance research.
4. Non-Destructive R&D Verification and Failure Mechanism Analysis
The equipment can conduct non-destructive structural verification of electronic product designs in the R&D stage and provide data support for root cause tracing and failure mechanism analysis of defective products. The dual-mode configuration of 2D imaging and 3D CT scanning enables it to meet the technical requirements of conventional quality inspection and high-precision microscopic analysis.
With outstanding resolution performance and non-destructive testing attributes, the equipment is an indispensable core testing platform for quality optimization and reliability systematic evaluation in the field of electronic manufacturing and semiconductor packaging.
Factory description
Wellman, a professional X-Ray inspection manufacturer which is integrates R&D, production and sales that is set up in China by Hong Kong-invested enterprises.
Wellman has many years of professional R&D team at home and abroad, has been committed to the global intelligent manufacturing equipment industry to provide micro-focus X-ray image detection equipment, casting process detection equipment, lithium battery reliability and safety detection equipment and special non-standard automation equipment one-stop service program.
Our headquarters locates in Shenzhen, since 2003, mainly engaged in automation technology, software technology and big data technology R&D, with more than 30 national patents and software copyright.
Our Advantages
R&D Strength
We independently master core technologies of micro-focus imaging and AI intelligent inspection. Our equipment meets international standards and adapts to high-precision X-ray inspection and SMD storage in various industries.
Global Compliance
Certified with ISO, CE, FDA and other authoritative international certifications, our products comply with global export standards and meet market access requirements worldwide.
Integrated Solution
We provide a full range of X-ray equipment and customized non-standard solutions, delivering one-stop systems including inspection equipment and SMD intelligent storage management.
Industry Reputation
With rich experience, our equipment is fully verified by mass factories and widely recognized by global customers for stable and reliable performance.
Global Service
Our global service system provides full-cycle one-stop support, including solution customization, installation training, technical maintenance and software upgrades.
Quality & Value
Supported by mature independent R&D and standardized production, we strictly follow international quality standards to deliver cost-effective and highly adaptable professional inspection solutions.
Knowledge
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Certifications
Rayence Flat Panel Detector
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Online Message
For save customer's time and energy, we provide the "ONE STOP" service that includes Call center register, Question require, Problem handling, Online diagnosis ,Spare parts shipping and return forwarding.