Product Overview

The X-ray Image Intensifier E5877J-P1K is a high-performance industrial imaging solution designed to provide clear and detailed X-ray images. It features very high resolution and efficient soft X-ray penetration, making it ideal for non-destructive inspection applications in industries such as electronics, automotive, and aerospace. This lightweight and compact device enhances imaging efficiency and precision, ensuring reliable and accurate results.

Product list:
E5877J-P1AK
E5877J-P1K
E5877-P1K
E5881-P1K

Product advantages

1. Achieves very high resolution up to 110 Lp/cm in M mode for detailed imaging.
2. Compact design with an overall length of 226 mm and a maximum diameter of 164 mm.
3. Lightweight, weighing approximately 8.0 kg for easy integration and handling.
4. CsI direct deposit input screen reduces X-ray scatter and improves detection efficiency.
5. Anti-reflective coating on the output screen enhances image quality.
6. Dual operation modes (N mode and M mode) for versatile imaging needs.
7. Fast setup with a preheat time of less than 3 minutes.
8. Compliance with international safety standards for reliable and safe operation.

Hardware parameters

Mechanical Specifications:
•Overall Length: 226±3 mm
•Maximum Diameter: 164±3 mm
•Nominal Entrance Field Size: typ. 100 mm
•Output Image Diameter: 20±1 mm
•Weight: approx. 8.0 kg

Electrical Specifications:
•Anode Voltage: 25 to 30 kV (N mode), 25 to 30 kV (M mode)
•G3 Electrode Voltage: 1.5 to 3.5 kV (N mode), 9.0 to 12.0 kV (M mode)
•G2 Electrode Voltage: 350 to 750 V (N mode), 150 to 550 V (M mode)
•G1 Electrode Voltage: 50 to 250 V (N mode), 150 to 350 V (M mode)
•Photocathode Voltage: 0 V

Power Supply Specifications:
•DC Power Supply Input Voltage: 100 to 240 Vac 30VA
•DC Power Supply Output Voltage: 24±1 Vdc
•DC Power Supply Output Current: 400 mA max.
•Weight: approx. 1 kg

Environmental Specifications:
•Operating Temperature: 5°C to 40°C
•Storage Temperature: -15°C to 45°C
•Operating Humidity: 30% to 85% RH (non-condensing)
•Storage Humidity: 10% to 90% RH (non-condensing)
•Operating Pressure: 70 to 106 kPa
•Storage Pressure: 50 to 106 kPa

Performance Specifications:
•Central Resolution: 77 Lp/cm (N mode), 110 Lp/cm (M mode)
•Conversion Factor (Gx): 90 cd/m2 (typ.) for 10 μGy/s (N mode), 90 cd/m2 (typ.) for 1 mR/s (M mode)
•Contrast Ratio: 22:1 (10% area) (N mode)

Safety and Handling Specifications:
•Maximum Fluoroscopic X-ray Tube Voltage: 125 kVp
•Maximum Input Dose Rate: Continuous 4.37×10^-4 Gy/min [50 mR/min], Pulsed 8.73×10^-3 Gy/min [1 R/min]
•Minimum Distance Between Focal Spot and Entrance Plane: 73 cm

Application description and sample images

1. PCBA & High-Density Packaging Inspection
Delivers precise non-destructive inspection for PCBA solder joints and high-density packaging devices such as BGA, CSP and QFN. It detects common flaws including cold solder, bridging and voids, and analyzes void ratio, while checking multi-layer PCB inner layer offset and short-circuit risks.
2. Semiconductor Chip Packaging Testing
Provides comprehensive internal structural evaluation for chip packaging. It inspects wire bonding quality, flip-chip underfill filling, 3D IC stacking interconnection reliability, and micro-bump integrity for wafer-level packaging applications.
3. Electronic Part & Material Quality Detection
Effectively inspects internal structures of capacitors, connectors, relays and other electronic components to detect cracks, misalignment and foreign object contamination. It also supports structural analysis for diverse electronic materials.
4. R&D Validation & Product Failure Diagnosis
Enables non-destructive design validation for new product development and accurate root cause localization for failure cases. Combining 2D imaging and 3D CT scanning technologies, it satisfies full-scene demands from daily quality screening to professional precision analysis.
Thanks to its high precision and non-destructive characteristics, the equipment guarantees reliable quality control and reliability verification for modern electronic manufacturing processes.